Adhesive - stencil
Adhesive stencils are used to solder SMD components with a solder wave, whereas the components are fixed with an adhesive. The adhesive spots are print in one printing process by using a lasercut stainless steel SMD - stencil and the components are placed and soldered afterwards. Stencils with a thickness of 150-400µm are used preferable. The diameter, height and number of the adhesive spot is determined by the component geometry, the data are prepared from the pick and place process or from an in-house library. The Adhesive Stencil replaces the expensive and time- consuming dispensing process.