Adhesive Stencil for adhesive printing

Laser cut stainless steel Adhesive Stencil for adhesive printing

Adhesive - stencil

Adhesive stencils are used to solder SMD components with a solder wave, whereas the components are fixed with an adhesive. The adhesive spots are print in one printing process by using a lasercut stainless steel SMD - stencil and the components are placed and soldered afterwards. Stencils with a thickness of 150-400µm are used preferable. The diameter, height and number of the adhesive spot is determined by the component geometry, the data are prepared from the pick and place process or from an in-house library. The Adhesive Stencil replaces the expensive and time- consuming dispensing process.

Benefits

Exact adhesive spot height

All adhesive spots in one printing process

Cost-effective alternative to the dispensing process

Andreas Axmann

+49 8141 52778-21

Adhesive - stencil

with round apertures for adhesive printing

Adhesive - stencil

with separated areas for the print process.

Adhesive - stencil

for "wet" in "wet" printing

Adhesive - stencil

for exact adhesive print hights

When it the use of an adhesive-/paste printing stencil necessary?

If it is not possible to solder all components with the solder wave, a combination of paste- and Adhesive- Stencil is used and a so called „wet“ in „wet“ printing step is carried out. In the first step the solder paste is applied for the reflow process by using a laser cut SMD – stencil. In the second step the Adhesive Stencil is used to print the adhesive for the solder wave process. To avoid a smearing of solder paste deposits during the adhesive print process a recess from the bottom side of the Adhesive Stencil is performed in height and form of the paste deposits and sealed with an adjustable cover. The size, height and form of the cover are individual adjusted on the layout of the printed circuit board.

Which advantages is offering the adhesive-/paste printing process?

With the help of an adhesive stencil exact adhesive dot heights are realized. In many cases the investment of the dispensing equipment is not necessary. The adhesive stencil is a cost-effective alternative to the dispensing process. The height of the adhesive dot is determined through the thickness of the stencil.